KUALA LUMPUR, March 6 (Bernama) -- Lantronix Inc has announced a significant strategic expansion of its embedded compute platform through new System-on-Module (SOM) solutions based on the Genio family of System-on-Chip (SOC) platforms from MediaTek Inc.
This expansion marks a strategic step in scaling Lantronix’s embedded compute ecosystem by broadening its solutions portfolio, increasing market coverage and strengthening its ability to serve high-growth industrial and commercial Edge AI deployments.
By expanding its silicon foundation, Lantronix in a statement said it enhances its ability to deliver performance-optimised, power-efficient compute platforms across a wider range of deployment requirements and volume tiers.
Lantronix chief strategy officer, Mathi Gurusamy said: “MediaTek expands our ability to serve a distinct segment of edge AI deployments — those optimised for power efficiency, performance-to-cost ratio and scalable volume production.
“By addressing these differentiated workload requirements, we increase our total addressable market, strengthen supply resiliency and position Lantronix to win a broader range of industrial and commercial design programmes worldwide.”
The addition of MediaTek-based SOMs broadens Lantronix’s platform to address high-volume, value-optimised and power-efficient Edge AI deployments, enabling customers to access premium performance-based, efficient inferencing workloads purpose-built for scalability across industries such as industrial automation, robotics, drones and warehouse automation.
Furthermore, this expanded multi-silicon strategy enables Lantronix to capture a broader spectrum of design wins, reduce dependency risk, provide long-term platform continuity to customers and improve supply chain resiliency.
Under the agreement, Lantronix will integrate MediaTek platforms optimised to simplify AI model development and deployment while delivering advanced multimedia processing and industrial-grade capabilities while also supporting the NVIDIA TAO framework.
Lantronix will showcase a drone technology demonstration developed with Teledyne FLIR OEM at Embedded World 2026 from March 10 to 12 in Nuremberg, Germany, highlighting real-time edge intelligence in vision-driven workloads.
-- BERNAMA
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