Monday, February 6, 2017

QUALCOMM AND TDK ANNOUNCE LAUNCH OF JOINT VENTURE

— RF360 Holdings to Enable Delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices, automotive and IoT —
 
SAN DIEGO & TOKYO, Feb 6 (Bernama-BUSINESS WIRE) -- Qualcomm Incorporated (NASDAQ:QCOM) and TDK Corporation (TOKYO:6762) today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), automotive applications, connected computing, and more. The business being transferred constitutes a part of the TDK SAW Business Group activities.


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